The Future of Liquid Cooling: Trends, Technologies, and Densities
DescriptionIn both HPC and enterprise environments, average rack density has been steadily increasing over the past 10 years. These increases are being driven by both the proliferation of compute-intensive workloads, significant increases in chip power dissipation and the growing demand for reducing data center footprints. In 2022, racks exceeding 100 kW are being deployed and average rack density ranges from 10 – 15 kW. When we look forward to 2032, we should anticipate that the trend of increasing rack densities continues, requiring current cutting-edge power and cooling technologies to transition to mainstream use, and several technological advancements to be made to support peak density applications. This presentation will summarize the current state-of-the-art power and cooling technologies for high density racks; discuss the trends of increasing thermal design power and decreasing case temperatures; share our best practices in the design and validation of direct liquid cooling (DLC) systems to ensure quality and reliability; and speculate on the technologies that may be observed in high density racks in ten years from now.
Presenter
Event Type
Exhibitor Forum
TimeTuesday, 15 November 20224pm - 4:30pm CST
LocationD171
Recorded
TP
XO/EX